26 | 04 | 2017

Call for Papers

Call for Papers

ISORC 2013: The 16th IEEE International Symposium on Object/component/service-oriented Real-time distributed computing

June 19-21, 2012

Paderborn, Germany
 

 Download Call for Papers: [PDF][DOCX]


Important Dates

Paper Submissions:            Nov 30, 2012

Acceptance Notification:       Feb 1, 2013

Camera-Ready Papers:        Mar 8, 2013

Symposium Dates                 June 19-21, 2013

 

Conference website: http://www.isorc.de

 

For submission please log into EasyChair at: https://www.easychair.org/conferences/?conf=isorc2013


Scope

This is the 16th IEEE Computer Society symposium dealing with the rapidly expanding field of object/component/service-oriented real-time distributed computing (ORC) technology. The principal theme of ISORC is the use of the object-oriented computing paradigm - which has prevailed in many non real-time applications in the past decades - in a wide variety of real-time applications. In the ISORC series, this paradigm emphasizes its spirit of openness where diverse views and new approaches to challenging issues can be freely discussed.

 

TOPICS OF INTEREST

Papers pertaining to all aspects of ORC are sought, including but not limited to the following:

  • Programming and system engineering: ORC paradigms, object/component models, languages, RT CORBA, Embedded .NET, RT RMI, RT Java, UML, model-driven development of high integrity applications, specification, design, verification, validation, testing, maintenance, system of systems, etc.
  • Distributed computing and communication infrastructures: Internet QoS (quality of service), real-time communication, networked computing platforms, protocols, peer-to-peer computing, sensor networks, inter-operability, security, trusted and dependable systems, fault tolerance, virtual subnets for ORC.
  • System software: real-time kernels and operating systems, middleware support for ORC, QoS management, extensibility, synchronization, resource allocation, scheduling, fault tolerance, security.
  • Applications: embedded systems (automotive, avionics, consumer electronics, building systems, sensors, etc), multimedia processing, RT Web-based applications and use of XML, real-time object-oriented simulations.
  • System evaluation: output accuracy, timeliness, worst-case execution time, dependability, end-to-end QoS, overhead, fault detection and recovery time.

Papers dealing with other issues that are related to the specification, design, implementation, and evaluation of ORC systems are also welcome. To promote dialogues between researchers and users of ORC, contributions from industry are particularly welcome.

 

SYMPOSIUM SESSION FORMATS

 Following the tradition of ISORC, the symposium program will consist of sessions of different formats:

  • presentations of regular and short papers,
  • panel discussions, and
  •  special sessions devoted to reporting industrial advances

 

GUIDELINES FOR MANUSCRIPTS

  • Research Papers. Papers should describe original work and be 8 pages or less in length using the IEEE paper format (link to templates). A maximum of two extra pages may be purchased.
  • Papers presenting Industrial Advances. Industrial papers and practitioner reports, describing experiences of using ORC technology in application or tool development projects, are an integral part of the technical program of ISORC. A majority of these papers are expected to be shorter and less formal than research papers. They should clearly identify, and discuss in detail, the issues that represent notable industrial advances. Reports with project metrics supporting their claims are particularly sought, as well as those that show both benefits and drawbacks of the approaches used in the given project.
  • Short Synopses. Short papers (5 pages or less using the IEEE format) on substantial real-time applications are also invited, and should contain enough information for the program committee to understand the scope of the project and evaluate the novelty of the problem or approach. 

According to program committee guidelines, papers presenting practical techniques, ideas, or evaluations will be favored. Papers reporting experimentation results and industrial experiences are particularly welcome. Originality will not be interpreted too narrowly. 

Papers that are based on severely unrealistic assumptions will not be accepted however mathematically or logically sophisticated the discussion may be. 

All accepted submissions will appear in the proceedings published by IEEE.

A person will not be allowed to present more than 2 papers at the symposium.

 

Organizers

Organizing Committee General co-Chairs:
Achim Rettberg, Carl von Ossietzky University Oldenburg, Germany
Roman Obermaisser, University of Siegen, Germany
Bran Selic, Simula Research Lab. & University of Toronto, Canada

PC co-Chairs:
Carlos E. Pereira, Federal University of Rio Grande do Sul, Brazil
Dooyhun Kim, Konkuk University Seoul, Korea
Robert Pettit, The Aerospace Corporation, USA

Steering Committee Chair:

Uwe Brinkschulte, University of Frankfurt, Germany
Eltefaat Shokri, The Aerospace Corporation, USA

Workshop Chair:
Peter Puschner,
TU Vienna, Austria

Industrial Chair:
Scott Moody, The Boeing Company, USA

Advisory and Publicity (APC) Chair:
Paul Townend, Leeds University, UK

Local Arrangement Chair:
Achim Rettberg, Carl von Ossietzky University Oldenburg, Germany

Publication and Web Chair:
Kay Klobedanz, University of Paderborn - C-LAB, Germany

Finance Chair:
Achim Rettberg, Carl von Ossietzky University Oldenburg, Germany

 

Technical Program Committee

Europe:

  • Martin Schoeberl, Vienna University of Technology, Austria
  • M. Teresa Higuera Toledano, UCM, Spain
  • Achim Rettberg, CvO Univ. Oldenburg, Germany
  • Fabrice Kordon, Univ. P. & M. Curie, France
  • Stefano Russo, Università di Napoli Federico, Italy
  • Peter Puschner, Technische Universitaet Wien, Austria
  • Neeraj Suri, Technical University Darmstadt, Germany
  • Jan Gustafsson, Malardalen University, Sweden
  • Stefan Kowalewski, RWTH Aachen, Germany
  • Theo Ungerer, Uni Augsburg, Germany
  • Mathias Pacher, Uni Frankfurt, Germany
  • Paul Ezhilchelvan, Newcastle School of Computing Science, UK
  • Hermann Härtig, Technical University Dresden, Germany
  • Matthias Werner, Technical University Chemnitz, Germany
  • Kurt Geihs, University Kassel, Germany
  • Andreas Polze, University of Potsdam, Germany
  • Andy Wellings, York University, UK
  • Wilfried Steiner, TTTech, Austria
  • Wolfgang Schröder-Preikschat, Univ. Nürnberg/Erlangen, Germany

Americas:

  • Shu-Ching Chen, Florida International U., USA
  • Juan Colmenares, Samsung Information Systems America, USA
  • Nathan Fisher, Wayne State University, Detroit MI, USA
  • Hassan Gomaa, George Mason Univ., USA
  • Sathish Gopalakrishan, University of British Columbia, Vancouver, Canada
  • Gabor Karsai, Vanderbilt University USA 
  • Insup Lee, University of Pennsylvania, Philadelphia PA, USA
  • Harini Ramaprasad, Southern Illionois University, Carbondale IL, USA
  • Sangyeun Cho, Samsung Electronics and Univ. of Pittsburg, USA
  • Julie Fant, The Aerospace Corporation, USA
  • Joseph Loyall, Raytheon/BBN, USA
  • Scott Moody, Boeing, USA
  • Alan Unell, The Aerospace Corporation, USA
  • Bran Selic, Malina Software, Canada

Asia / Pacific:

  • Hiroo Ishikawa, Panasonic, Japan  
  • Zonghua Gu, Zhejiang University, China
  • Pi-Cheng Hsiu, Academia Sinica, Taiwan
  • Micheal Lyu, The Chinese University of Hong Kong, China
  • Tatsuo Nakajima, Waseda University, Japan
  • Liu Yang, National University of Singapore, Singapore
  • Chang-Gun Lee, Seoul National University, Korea
  • Sungdeok Cha, Korea University., Korea 
  • Tomoya Enokido, Risho University, Japan
  • Sang Lyul Min , Seoul National University, Korea 
  • Yukikazu Nakamoto, University of Hyogo/Nagoya University, Japan
  • Shinpei Kato, Nagoya University , Japan
  • Shuichi Oikawa, Tsukuba University, Japan
  • Hyun-Wook Jin, Konkuk University, Korea
  • Hu Chunming, Beihang University, China
  • Liu Weining, Chongqing University, China 

 

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